SP3010 Datasheet, PDF (5/5 Pages) Littelfuse – Ultra-Low Capacitance Diode Array for ESD Protection

SPA™ Silicon Protection Array Products
Ultra-Low Capacitance Diode Array for ESD Protection
Embossed Carrier Tape & Reel Specification – UDFN-10
P0
P1
P2
D0
T
D1
A0
5º Max
5º Max
Package
Symbol
A0
B0
D0
D1
E
F
K0
P0
P1
P2
T
W
uDFN-10 (2.5x1.0x0.5mm)
Millimeters
1.30 +/- 0.10
2.83 +/- 0.10
Ø 1.50 + 0.10
Ø 1.00 + 0.25
1.75 +/- 0.10
3.50 +/- 0.05
0.65 +/- 0.10
4.00 +/- 0.10
4.00 +/- 0.10
2.00 +/- 0.05
0.254 +/- 0.02
8.00 + 0.30 /- 0.10
Package Dimensions - uDFN-10 (2.5x1.0x0.5mm)
Top View
D
A
E
0.05 C
A
Seating
Plane
C
Side View
B
A1 ^A3
b1
b
0.05 C
0.10 M C A B
0.05 M C
Bottom View
R0.125
Symbol
A
A1
A3
b
b1
D
E
e
L
uDFN-10 (2.5x1.0x0.5mm)
Millimeters
Inches
Min
Nom
Max
0.48
0.515
0.55
0.00
--
0.05

3FG
0.15
0.20
0.25
0.35
0.40
0.45
2.40
2.50
2.60
0.90
1.00
1.10
0.50 BSC
0.30
0.365
0.43
Min
Nom
0.019 0.020
0.000

3FG
0.006 0.008
0.014 0.016
0.094 0.098
0.035 0.039
0.020 BSC
0.012 0.014
Max
0.021
0.022
0.012
0.018
0.102
0.043
0.016
L
2xR0.075mm (7x)
e
Soldering Pad Layout
P1
P
Z (C) G
Y
(Y1)
X
X1
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Soldering Pad Layout Dimensions
Inch
Millimeter
C
(0.034)
(0.875)
G
0.008
0.20
P
0.020
0.50
P1
0.039
1.00
X
0.008
0.20
X1
0.016
0.40
Y
0.027
0.675
Y1
(0.061)
Z
0.061
(1.55)
1.55
71
Revised: February 25, 2010
SP3010 Lead-Free/Green Series