SP3010 Datasheet, PDF (4/5 Pages) Littelfuse – Ultra-Low Capacitance Diode Array for ESD Protection

SPA™ Silicon Protection Array Products
Ultra-Low Capacitance Diode Array for ESD Protection
Soldering Parameters
Reflow Condition
1C
o
'SFF
BTTFNCMZ
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
250^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
Part Numbering System
SP 3010 ^– 0x U T G
Silicon
Protection
Array
Series
G= Green
T= Tape & Reel
Number of
Channels
-04 = 4 Channel
Package
UDFN-10 (2.5x1.0mm)
Part Marking System
QH 4
Product Series
Number of
Q = SP3010
Channels
Assembly Site
Product Characteristics
Lead Plating
1SF1MBUFE
'SBNF
Lead Material
Lead Coplanarity
Subsitute Material
$PQQFS
"MMPZ
0.0004 inches (0.102mm)
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
/PUFT




"MM
EJNFOTJPOT
BSF
JO
NJMMJNFUFST
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.


"MM
TQFDJmDBUJPOT
DPNQMZ
UP
+&%&$
41&$
.0
*TTVF
"
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Ordering Information
Part Number
4165(
Package
V%'/
Marking
QH4
Min. Order Qty.
3000
SP3010 Lead-Free/Green Series
70
Revised: February 25, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.