SP3003-08ATG Datasheet, PDF (5/7 Pages) Littelfuse – SP3003 Series 0.65pF Diode Array

TVS Diode Arrays (SPA^® Diodes)
Low Capacitance ESD Protection - SP3003 Series
Package Dimensions — SOT563
D
65 4
E
23
A
L
Recommended
Solder Pad Layout
HE
e
c
B
Package Dimensions — MSOP10
R_Re_ec_co_om_mmm_ae_ndn_ed_de_Sd_olS_deo_rld_Pe_adr _LP_aa_yd_out
Layout
Package Dimensions —µDFN-6L
Recommended
Solder Pad Layout
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/20/13
Package
Pins
A
B
c
D
E
e
L
HE
SOT 563
6
Millimeters
Inches
Min
Max
Min
Max
0.50
0.60
0.020
0.024
0.17
0.27
0.007
0.011
0.08
0.18
0.003
0.007
1.50
1.70
0.059
0.067
1.10
1.30
0.50 BSC
0.10
0.30
1.50
1.70
0.043
0.051
0.020 BSC
0.004
0.012
0.059
0.067
Package
JEDEC
Pins
A
A1
B
c
D
E
E1
e
HE
MSOP10
MO-187
10
Millimeters
Inches
Min
Max
Min
Max
-
1.10
-
0.043
0.00
0.15
0.000
0.006
0.17
0.27
0.007
0.011
0.08
0.23
0.003
0.009
2.90
3.10
0.114
0.122
4.67
5.10
2.90
3.10
0.50 BSC
0.40
0.80
0.184
0.200
0.114
0.122
0.020 BSC
0.016
0.031
Package
JEDEC
Pins
A
A1
A3
b
b1
D
D2
E
E2
e
L
µDFN-6L
MO-229
Millimeters
Min
Max
0.45
0.55
0.00
0.05
0.125REF
0.35
0.45
0.15
0.25
6
Inches
Min
Max
0.018
0.022
0.000
0.002
0.005REF
0.014
0.018
0.006
0.010
1.55
1.65
-
-
0.95
1.05
-
-
0.50REF
0.33
0.43
0.062
0.065
-
-
0.038
0.042
-
-
0.020REF
0.013
0.017