SP3003-08ATG Datasheet, PDF (3/7 Pages) Littelfuse – SP3003 Series 0.65pF Diode Array

TVS Diode Arrays (SPA^® Diodes)
Low Capacitance ESD Protection - SP3003 Series
Capacitance vs. Frequency
1.4E-12
1.2E-12
1E-12
8E-13
6E-13
4E-13
2E-13
0
1.E+06
1.E+07
1.E+08
Frequency [Hz]
1.E+09
Product Characteristics
Lead Plating
Lead Material
Matte Tin (SC70-x, MSOP-10) Pre-Plated
Frame (SOT5x3, µDFN-6)
Copper Alloy
Lead Coplanarity
Substitute
Material
Body Material
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
T_P
T_L
T_S(max)
T_S(min)
Ramp-up
Preheat
t_S
25
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/20/13