SP3001_10 Datasheet, PDF (5/6 Pages) Littelfuse – Low Capacitance ESD Protection Array

SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions - SC70-6
ee
654
E HE
1 23
B
D
A2 A
A1
C
Solder Pad Layout
L
Package
Pins
JEDEC
A
A1
A2
B
c
D
E
e
HE
L
SC70-6
6
MO-203 Issue A
Millimeters
Inches
Min
Max
Min
Max
0.80
1.10
0.031
0.043
0.00
0.10
0.000
0.004

1.00
0.028
0.039
0.15
0.30
0.006
0.012
0.08
0.25
0.003
0.010
1.85
2.25

0.089
1.15
1.35
0.045
0.053
0.65 BSC
0.026 BSC
2.00
2.40

0.094
0.26
0.46
0.010
0.018
Part Numbering System
SP3001-04 J T G
Silicon
Protection
Array
Series
Number of Channels
-04 = 4 channel
G= Green
T= Tape & Reel
Package
J = SC70-6, 3000 quantity
Part Marking System
DX4
DX4
Product Series
D = SP3001 series
Number of Channels
Assembly Site
(varies)
Ordering Information
Part Number
SP3001-04JTG
Package
4$
Product Characteristics
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Body Material
Silicon
Molded Epoxy
Flammability
UL94-V-0
/PUFT


1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Marking
DX4
Min. Order Qty.
3000
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
43
Revised: February 9, 2010
SP3001 Lead-Free/Green Series