SP6001-04UTG-1 Datasheet, PDF (4/8 Pages) Littelfuse – SP6001 Lead-Free/Green Series

SPA™ Silicon Protection Array Products
12pF EMI Filter Array with ESD Protection
Application Example
PCB Connector
for LCD Display
D1
D2
D3
D4
SP6001-04UTG-1
Baseband
IC
Camera Module
D1
D2
D3
D4
D5
D6
D7
D8
SP6001-08UTG-1
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp
(T ) to peak
L
T toT - Ramp-up Rate
S(max)
L
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peakTemperature (T )
P
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
250^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
Baseband
IC
SP6001 Lead-Free/Green Series
90
Revised: March 25, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.