SP3012 Datasheet, PDF (4/4 Pages) Littelfuse – SP3012 Series 0.5pF Rail Clamp Array

TVS Diode Arrays (SPA^™Family of Products)
Low Capacitance ESD Protection - SP3012 Series
Embossed Carrier Tape & Reel Specification — μDFN-10
P0
P1
P2
D0
T User Feeding Direction
D1
A0
5º Max
5º Max _{Pin 1 Location}
Package
Symbol
A0
B0
D0
D1
E
F
K0
P0
P1
P2
T
W
μDFN-10 (2.5x1.0x0.5mm)
Millimeters
1.30 +/- 0.10
2.83 +/- 0.10
Ø 1.50 + 0.10
Ø 1.00 + 0.25
1.75 +/- 0.10
3.50 +/- 0.05
0.65 +/- 0.10
4.00 +/- 0.10
4.00 +/- 0.10
2.00 +/- 0.05
0.254 +/- 0.02
8.00 + 0.30 /- 0.10
Package Dimensions — μDFN-10 (2.5x1.0x0.5mm)
Top View
D
A
E
0.05 C
A
Seating
Plane
C
Side View
B
A1 ^A3
b1
b
0.05 C
0.10 M C A B
0.05 M C
Bottom View
R0.125
L
2xR0.075mm (7x)
e
Symbol
A
A1
A3
b
b1
D
E
e
L
μDFN-10 (2.5x1.0x0.5mm)
Millimeters
Inches
Min
Nom
Max
0.48
0.515
0.55
0.00
--
0.05

3FG
0.15
0.20
0.25
0.35
0.40
0.45
2.40
2.50
2.60
0.90
1.00
1.10
0.50 BSC
0.30
0.365
0.43
Min
Nom
0.019
0.000
0.020

3FG
0.006 0.008
0.014 0.016
0.094 0.098
0.035 0.039
0.020 BSC
0.012 0.014
Max
0.021
0.022
0.012
0.018
0.102
0.043
0.016
Soldering Pad Layout Dimensions
Inch
Millimeter
C
(0.034)
(0.875)
G
0.008
0.20
P
0.020
P1
0.039
X
0.008
X1
0.016
Y
0.027
Y1
(0.061)
Z
0.061
0.50
1.00
0.20
0.40
0.675
(1.55)
1.55
Recomended
Soldering Pad Layout
P1
P
Z (C) G
Y
(Y1)
X
X1
Alternative
Soldering Pad Layout
P1
P
Z (C) G
Y
(Y1)
SP3012 Series

Revision: January 4, 2012
X
X1
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.