SP3012 Datasheet, PDF (3/4 Pages) Littelfuse – SP3012 Series 0.5pF Rail Clamp Array

TVS Diode Arrays (SPA^™Family of Products)
Low Capacitance ESD Protection - SP3012 Series
Soldering Parameters
Reflow Condition
1C
o
'SFF
BTTFNCMZ
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp
(T ) to peak
L
T toT - Ramp-up Rate
S(max)
L
Reflow
-Temperature (T ) (Liquidus)
L
-Temperature (t )
L
PeakTemperature (T )
P
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peakTemperature (T )
P
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
T_P
T_L
T_S(max)
T_S(min)
Ramp-up
Preheat
t_S
25
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
Part Numbering System
SP 3012 ^– 04 U T G
Silicon Protection
Array (SPA^TM)
Family of
TVS Diode Arrays
Series
Number of
Channels
G= Green
T= Tape & Reel
Package
μDFN-10 (2.5x1.0mm)
Part Marking System
VH4
Product Series
Number of
V = SP3012
Channels
Assembly Site
Product Characteristics
Lead Plating
1SF1MBUFE
'SBNF
Lead Material
$PQQFS
"MMPZ
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
6-

7
/PUFT




"MM
EJNFOTJPOT
BSF
JO
NJMMJNFUFST
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.


"MM
TQFDJmDBUJPOT
DPNQMZ
UP
+&%&$
41&$
.0
*TTVF
"
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Ordering Information
Part Number
4165(
Package
˜%'/
Marking
VH4
Min. Order Qty.
3000
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.

Revision: January 4, 2012
SP3012 Series