SP3130 Datasheet, PDF (3/5 Pages) Littelfuse – TVS Diode Arrays (SPA ® Diodes)

TVS Diode Arrays (SPA^®®Diodes)
Low Capacitance ESD Protection - SP3130 Series
Transmission Line Pulsing (TLP) Plot
20
18
16
14
12
10
8
6
4
2
0
0 5 10 15 20 25 30 35 40 45 50 55 60
TLP Voltage (V)
Soldering Parameters
Reflow Condition
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp (T_L)
to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
Pb – Free assembly
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
Part Numbering System
SP 3130 ^– 01 x T G
TVS Diode Arrays
(SPA^® Diodes)
Series
Number of
Channels
G= Green
T= Tape & Reel
Package
W: 0201 Flipchip
E: SOD882
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 08/04/16
Insertion Loss (S21)
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
10
100
Frequency (MHz)
1000
T_P
T_L
T_S(max)
T_S(min)
Ramp-up
Preheat
t_S
25
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
Product Characteristics of 0201 Flipchip
Lead Plating
Lead Material
Lead Coplanarity
Substrate material
Body Material
Sn
Copper
6µm(max)
Silicon
Silicon
Product Characteristics of SOD882
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.004 inches(0.102mm)
Substrate material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.