SP3021 Datasheet, PDF (3/4 Pages) Littelfuse – The SP3021 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD).

TVS Diode Arrays (SPA^™Family of Products)
Low Capacitance ESD Protection - SP3021 Series
Product Characteristics
Lead Plating
Pre-Plated Frame or Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
Ordering Information
Part Number
SP3021-01ETG
Package
SOD882
Marking
•e
Min. Order Qty.
3000
T_P
T_L
T_S(max)
T_S(min)
Ramp-up
Preheat
t_S
25
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
Part Numbering System
SP 3021 ^– 01 E T G
Silicon Protection
Array (SPA^TM)
Family of
TVS Diode Arrays
Series
Number of
Channels
G= Green
T= Tape & Reel
Package
E: SOD882
Part Marking System
SOD882
e
Pin 1 Indicator
Product ID
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
3
Revision: June 4, 2012
SP3021 Series