SP3021 Datasheet, PDF (2/4 Pages) Littelfuse – The SP3021 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD).

TVS Diode Arrays (SPA^™Family of Products)
Low Capacitance ESD Protection - SP3021 Series
Absolute Maximum Ratings
Thermal Information
Symbol
Parameter
Value
Units
I_PP
Peak Current (t_p=8/20μs)
2.0
A
T_OP
Operating Temperature
-40 to 85
°C
T_STOR
Storage Temperature
-50 to 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Parameter
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature
(Soldering 20-40s)
Electrical Characteristics (T_OP=25ºC)
Parameter
Symbol
Test Conditions
Min
Reverse Standoff Voltage
V_RWM
Reverse Breakdown Voltage
V_BR
1_R=1mA
7.0
Reverse Leakage Current
I_LEAK
V_R=5V
Clamp Voltage¹
V_C
I_PP=1A, t_p=8/20µs, Fwd
I_PP=2A, t_p=8/20µs, Fwd
Dynamic Resistance
R_DYN
(V_C2-V_C1)/(I_PP2-I_PP1)
ESD Withstand Voltage¹
IEC61000-4-2 (Contact)
±8
V_ESD
IEC61000-4-2 (Air)
±15
Typ
13.1
14.7
1.6
Diode Capacitance¹
C_D
Reverse Bias=0V
0.5
Note: 1. Parameter is guaranteed by design and/or device characterization.
Rating Units
-65 to 150 °C
150
°C
260
°C
Max
5.0
1
Units
V
V
µA
V
V
Ω
kV
kV
pF
Capacitance vs. Bias Voltage
Insertion Loss (S21) I/O to GND
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
1
2
3
4
5
DC Bias (V)
Pulse Waveform
0
-5
-10
-15
-20
-25
-30
-35
10
100
1000
Frequency (MHz)
Transmission Line Pulsing(TLP) Plot
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Time (μs)
SP3021 Series
2
Revision: June 4, 2012
TLP Voltage (V)
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.