SP3010_11 Datasheet, PDF (3/4 Pages) Littelfuse – SP3010 Series 0.45pF Rail Clamp Array

TVS Diode Arrays (SPA^™Family of Products)
Low Capacitance ESD Protection - SP3010 Series
Soldering Parameters
Reflow Condition
Pb – Free assembly
-Temperature Min (T )
s(min)
Pre Heat -Temperature Max (T )
s(max)
-Time (min to max) (t )
s
Average ramp up rate (Liquidus) Temp
(T ) to peak
L
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t )
p
Ramp-down Rate
Time 25°C to peakTemperature (T )
P
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
250^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
T_P
T_L
T_S(max)
T_S(min)
Ramp-up
Preheat
t_S
25
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
Part Numbering System
SP 3010 ^– 0x U T G
Silicon Protection
Array (SPA^TM)
Family of
TVS Diode Arrays
Series
Number of
Channels
-04 = 4 Channel
G= Green
T= Tape & Reel
Package
UDFN-10 (2.5x1.0mm)
Part Marking System
QH 4
Product Series
Number of
Q = SP3010
Channels
Assembly Site
Product Characteristics
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Body Material
Silicon
Molded Epoxy
Flammability
UL94-V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Ordering Information
Part Number
SP3010-04UTG
Package
uDFN-10
Marking
QH4
Min. Order Qty.
3000
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
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Revision: April 14, 2011
SP3010 Series