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SMF3.3 Datasheet, PDF (3/4 Pages) Semtech Corporation – 3.3 Volt TVS Array For ESD and Latch-Up Protection
TVS Diodes
Surface Mount – 200W > SMF3.3 Series
Figure 5 - Capacitance vs. Reverse Bias
120
100
80
60
40
20
0
0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3
Bias Voltage (V)
Figure 6 - 8/20μS Pulse Waveform
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Time (μs)
Soldering Parameters
Reflow Condition
Lead–free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (Liquidus Temp (TA)
to peak
TS(max) to TA - Ramp-up Rate
Reflow
- Temperature (TA) (Liquidus)
- Time (min to max) (ts)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
Physical Specifications
Case
Polarity
Terminal
SOD-123FL plastic over passivated
junction
Color band denotes cathode except bipolar
Matte tin-plated leads, solderable per
JESD22-B102
TP
TL
Ts(max)
Ts(min)
25˚C
Ramp-up
tp
tL
Critical Zone
TL to TP
ts
Preheat
Ramp-down
t 25˚C to Peak
Time (t)
High Reliability Test Specification
Pre-condition
(HTRB/ TC/ PCT/
H3TRB)
(1) Bake 24hrs @150°C
(2)168hrs @85% RH and 85°C
(3) IR reflow,3 reflows, peak temperature of
260°C
HTRB
Temperature Cycling
JESD 22-108C
VCC bias= 80%VDRM & TA=150°C, 1008hrs
MIL-STD-883F, Method 1010.8 Condition C
-65°C to150°C, 1000 cycles
Pressure Cooker
JEDEC 22-A102C
100%RH @121°C @15psi, 96hrs
Bias Humidity
(H3TRB)
JESD 22-A101B
Vcc bias (pin1to pin3)=VDRM ,85%RH, 85°C ,
1008 hours
RSH
JESD 22-A111
260°C ,10 secs.
©2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/28/16