SMF3.3 Datasheet, PDF (1/4 Pages) Semtech Corporation – 3.3 Volt TVS Array For ESD and Latch-Up Protection

SMF3.3
TVS Diodes
Surface Mount – 200W > SMF3.3 Series
RoHS
Pb e3
Uni-directional
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E230531
Maximum Ratings and Thermal Characteristics
(T_A=25^OC unless otherwise noted)
Parameter
Peak Pulse Power _8/20µs
Dissipation at
T_A=25ºC (Note 1) ^10/1000µs
Thermal Resistance Junction- to-
Ambient
Symbol
P_PPM
R_θJA
Thermal Resistance Junction- to- Lead R_θJL
Value
1200
200
220
100
Unit
W
W
°C/W
°C/W
Operating Temperature Range
T_J -55 to 150 °C
Storage Temperature Range
T_STG -55 to 150 °C
Notes:
1. Non-repetitive current pulse, per Fig. 4 & 6 and derated above T_J (initial) =25ºC per Fig. 3.
Functional Diagram
Bi-directional
Cathode
Uni-directional
Anode
Description
SMF3.3 is designed specifically to protect sensitive
electronic equipment from voltage transients induced by
lightning and other transient voltage events.
Features
• 2 00W peak pulse power
capability at 10/1000µs
waveform, repetition rate
(duty cycle): 0.01%
• 1 200W peak pulse power
capability at 8/20us
waveform
• Excellent clamping
capability
• C ompatible with industrial
standard package SOD-
123FL
• L ow profile: maximum
height of 1.08mm.
• F or surface mounted
applications to optimize
board space
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• E SD protection of data
lines in accordance with
IEC 61000-4-2
• E FT protection of data
lines in accordance with
IEC 61000-4-4
• F ast response time:
typically less than 1.0ns
from 0 Volts to V_BR min
• H igh temperature
soldering: 260°C/40
seconds at terminals
• Built-in strain relief
• M eet MSL level1, per
J-STD-020C, LF maximun
peak of 260°C
• M atte tin lead–free plated
• Halogen-free and RoHS
compliant
• Pb-free E3 means 2^nd level
interconnect is Pb-free
and the terminal finish
material is tin(Sn) (IPC/
JEDEC J-STD-609A.01)
Applications
SMF3.3 devices are ideal for the protection of portable
devices/hard drives, notebooks, V_CC busses, POS terminal,
SSDs, power supplies, monitors, and vulnerable circuit
used in other consumer applications.
Electrical Characteristics (T_A=25°C unless otherwise noted)
Part Marking
Number Code
Breakdown
Voltage V_BR
(Volts) @ I_T
MIN MAX
Test
Current
I_T
(mA)
Reverse
Stand off
Voltage V_R
(V)
Maximum
Reverse
Leakage @ V_R
I_R (µA)
SMF3.3
33
3.4
4.3
10
3.3
0.5
Notes:
1. V_BR measured after I_T applied for 300µs, I_T = sequare wave pulse or equivalent.
2. Surge current waveform per 10/1000µs exponential wave and derated per Fig.2.
3. All terms and symbols are consistent with ANSI/IEEE C62.35.
4. Surge current waveform per 8/20µs exponential wave and derated per Fig.6.
Maximum
Peak Pulse
Current
(10/1000μS)
I_pp (A)
30.0
Maximum
Clamping
Voltage @I_pp
(10/1000μS)
V_C (V)
6.8
Maximum
Peak Pulse
Current
(8/20μS)
I_pp (A)
120.0
Maximum
Clamping
Voltage @I_pp
(8/20μS)
V_C (V)
10.0
©2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/28/16