SLVU2.8 Datasheet, PDF (3/4 Pages) Semtech Corporation – Low Voltage EPD TVS Diode For ESD and Latch-Up Protection

TVS Diode Arrays (SPA^™Family of Products)
Lightning Surge Protection - SLVU2.8 Series
Application Example Detail
Data Line
Protection of one unidirectional line
D1
Protection of one unidirectional data line is realized by
connecting pin 3 to the protect_Ne_Cd line, and pins 1 and 2 to
GND.In this configuration, the device presents a maximum
loading capacitance of tens of picofarads. During positive
transients_D2, the internal TVS diode will conduct and steer
cu_Drr_ae_tan_Lt_inf_erom_Lop_win_cap3_act_io_tan1_ce(_pG_roN_teD_cti)_o,_nc_ol_fa_om_nep_hi_in_ghg_st_ph_eee_d d_daa_tata_pal_ii_rne at or
below the specified voltages for the device (see Electrical
Characteristics section). For negative transients, the internal
compensating diode is forward biased, steering the current
from pin 2 (GND) to 3.
Protection of one unidirectional line
D1
NC
D2
Low capacitance protection of one high speed data pair
Low capacitance protection of a high-speed data pair is
realized by connecting two devices in antiparallel. As shown,
pin 1 of the first device is connected to D1 and pin 2 is
connected to D2. Additionally, pin 2 of the second device is
connected to D1 and pin 1 is connected to D2. Pin 3 must be
NC (or not connected) for both devices. When the potential
on D1 exceeds the potential on D2 (by the rated standoff
voltage), pin 2 on the second device will steer current into
pin 1. The compensating diode will conduct in the forward
direction steering current into the avalanching TVS diode
which is operating in the reverse direction. For the opposite
transient, the first device will behave in the same manner. In
this two device arrangement, the total loading capacitance is
two times the rated capacitance from pin 2 to pin 1 which will
typically be much less than 10pF making it suitable for high-
speed data pair such as 10/100/1000 Ethernet.
RJ-45
Connector
J1
NC
Ethernet
PHY
J8
NC
Product Characteristics
Lead Plating
Matte Tin
Lead Material
Lead Coplanarity
Substitute Material
Body Material
Flammability
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4.Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
T_P
T_L
T_S(max)
T_S(min)
Ramp-up
Preheat
t_S
25
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
3
Revision: February 15, 2012
SLVU2.8 Series