AQ1026 Datasheet, PDF (3/4 Pages) Littelfuse – AEC-Q101 qualified

TVS Diode Arrays (SPA^®®Diodes)
General Purpose ESD Protection - SAPQ11002266SSeerriieess
Clamping Voltage vs. I_PP
20
18
16
14
12
10
8
6
4
2
0
1
2
3
4
5
Peak Pulse Current-I_PP (A)
Soldering Parameters
Reflow Condition
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp (T_L)
to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Pb – Free assembly
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
Product Characteristics
Lead Plating
Matte Tin or Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.004 inches(0.102mm)
Substrate material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Transmission Line Pulsing(TLP) Plot
20
15
10
5
0
0
5
10
15
20
25
TLP Voltage (V)
T_P
T_L
T_S(max)
T_S(min)
25
Ramp-up
Preheat
t_S
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 04/07/16
SP1007 Series