2016L030_08 Datasheet, PDF (3/5 Pages) Littelfuse – POLYFUSE® Resettable PTCs

POLYFUSE^® Resettable PTCs
Surface Mount > 2016L Series
Soldering Parameters
Condition
Reflow
Peak Temp/ Duration Time
260°C / 10 Sec
Time above liquids (TAL) 220°C
60 Sec ~ 100 Sec
Preheat 120°C~ 180°C
Storage Condition
50 Sec ~ 150 Sec
0°C~35°C, ^<=70%RH
t

3FDPNNFOEFE
SFnPX
NFUIPET
*3
WBQPS
QIBTF
PWFO
IPU
BJS

oven, N₂ environment for lead–free
t
3
FDPNNFOEFE
NBYJNVN
QBTUF
UIJDLOFTT
JT
NN

JODI
t
%
FWJDFT
DBO
CF
DMFBOFE
VTJOH
TUBOEBSE
JOEVTUSZ
NFUIPET
BOE

solvents.
Note: If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Lead Solderability
Meets EIA Specification RS186-9E, ANSI/
J-STD-002 Category 3.
Soldering
260
220
Preheating
180
120
Cooling
0
50 to 150
60 to 100
120
Time(s)
Environmental Specifications
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped
State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Vibration
-40°C to +85°C
125°C
+85°C, 1000 hours
-/+5% typical resistance change
+85°C, 85%,R.H.,1000 hours
-/+5% typical resistance change
MIL–STD–202, Method 107G
+85°C/-40°C 20 times
-30% typical resistance change
MIL–STD–202, Method 215
No change
MIL–STD–883C, Method 2007.1,
Condition A
No change
Moisture Sensitivity Level Level 2, J–STD–020C
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/2016L.html for current information.
Revised: October 24, 2008
2016L Series