LTC3586_15 Datasheet, PDF (34/36 Pages) Linear Technology – High Efficiency USB Power Manager with Boost, Buck-Boost and Dual Bucks

LTC3586/LTC3586-1
Package Description
UFE Package
38-Lead Plastic QFN (4mm × 6mm)
(Reference LTC DWG # 05-08-1712 Rev B)
0.70 p0.05
4.50 p 0.05
3.10 p 0.05
2.40 REF
2.65 p 0.05
4.65 p 0.05
PACKAGE OUTLINE
0.20 p0.05
0.40 BSC
4.40 REF
5.10 p 0.05
6.50 p 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 p 0.10
0.75 p 0.05
R = 0.10
TYP
PIN 1
TOP MARK
(NOTE 6)
2.40 REF
PIN 1 NOTCH
R = 0.30 OR
0.35 s 45o
CHAMFER
37 38
0.40 p 0.10
1
2
4.65 p 0.10
6.00 p 0.10
4.40 REF
2.65 p 0.10
34
0.200 REF R = 0.115
0.00 – 0.05
TYP
(UFE38) QFN 0708 REV B
0.20 p 0.05
0.40 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3586fb