LTC3769_15 Datasheet, PDF (31/32 Pages) Linear Technology – 60V Low IQ Synchronous Boost Controller

Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTC3769
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation CA
6.07
(.239)
4.95
(.195)
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
2.74
(.108)
0.45 ±0.05
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
6.40 – 6.60*
(.252 – .260)
4.95
(.195)
20 1918 17 16 15 14 1312 11
DETAIL A
DETAIL A
1.98
(.078)
REF
2.74
(.108)
6.40
(.252)
BSC
0.56
(.022)
REF
DETAIL A IS THE PART OF
THE LEAD FRAME FEATURE
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
1 2 3 4 5 6 7 8 9 10
6.07
(.239)
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE20 (CA) TSSOP REV K 0913
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnecFtoiornmofoitrsecinrcfuoitrsmasatdieosncrwibwedwh.elirneeinawr.cillonmot/iLnTfrCin3g7e6o9n existing patent rights.
3769f
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