LTC1293DCSW Datasheet, PDF (27/28 Pages) Linear Technology – Single Chip 12-Bit Data Acquisition System

LTC1293/LTC1294/LTC1296
PACKAGE DESCRIPTIO Dimensions in inches (millimeters) unless otherwise noted.
0.290 - 0.320
(7.366 - 8.128)
GLASS
SEALANT
0.160
(4.064)
MAX
0.015 – 0.060
(0.381 – 1.524)
0° – 15°
0.008 – 0.018
(0.203 – 0.457)
0.385 ± 0.025
(9.779 ± 0.635)
0.125
(3.175)
MIN
0.080
(2.032)
MAX
J Package
20-Lead Ceramic DIP
0.038 – 0.068
(0.965 – 1.727)
0.014 – 0.026
(0.356 – 0.660)
0.200
(5.080) 0.220 - 0.310 0.025
MAX _{(5.588 - 7.874) (0.635)}
RAD TYP
0.100 ± 0.010
(2.540 ± 0.254)
OBSOLETE PACKAGE
1.060
(26.924)
MAX
20 19 18 17 16 15 14 13 12 11
1 2 3 4 5 6 7 8 9 10
0.005
(0.127)
J20 12/91
T_JMAX
150°C
θ_JA
80°C/W
0.300 – 0.325
(7.620 – 8.255)
0.009 - 0.015
(0.229 - 0.381)
+0.025
0.325 _–0.015
( ) 8.255
+0.635
–0.381
0.130 ± 0.005
(3.302 ± 0.127)
0.015
(0.381)
MIN
0.125
(3.175)
MIN
N Package
16-Lead Plastic DIP
0.045 – 0.065
(1.143 – 1.651)
0.045 ± 0.015
(1.143 ± 0.381)
0.100 ± 0.010
(2.540 ± 0.254)
0.065
(1.651)
TYP
0.260 ± 0.010
(6.604 ± 0.254)
0.018 ± 0.003
(0.457 ± 0.076)
0.770
(19.558)
16 15 14 13 12 11 10 9
12
3
4
5
6
78
T_JMAX
110°C
N16 1291
θ_JA
100°C/W
0.300 – 0.325
(7.620 – 8.255)
0.009 – 0.015
(0.229 – 0.381)
+0.025
0.325 _–0.015
( ) 8.255
+0.635
–0.381
0.130 ± 0.005
(3.302 ± 0.127)
0.015
(0.381)
MIN
0.125
(3.175)
MIN
N Package
20-Lead Plastic DIP
0.045 – 0.065
(1.143 – 1.651)
1.040
(26.416)
MAX
20 19 18 17 16 15 14 13 12 11
0.065 ± 0.015
(1.651 ± 0.381)
0.100 ± 0.010
(2.540 ± 0.254)
0.018 ± 0.003
(0.457 ± 0.076)
0.065
(1.651)
TYP
0.260 ± 0.010
(6.604 ± 0.254)
1 2 3 4 5 6 7 8 9 10
T_JMAX
110°C
N20 0192
θ_JA
100°C/W
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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