LT3837_15 Datasheet, PDF (26/28 Pages) Linear Technology – Isolated No-Opto Synchronous Flyback Controller

LT3837
PACKAGE DESCRIPTION
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev J)
Exposed Pad Variation BC
3.58
(.141)
4.90 – 5.10*
(.193 – .201)
3.58
(.141)
16 1514 13 12 11 109
0.48
(.019)
REF
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
2.94
(.116)
0.45 ±0.05
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
DETAIL B
2.94
(.116)
6.40
(.252)
BSC
0.51
(.020)
REF
DETAIL B IS THE PART OF
THE LEAD FRAME FEATURE
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
12345678
1.10
(.0433)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE16 (BC) TSSOP REV J 1012
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
3837fd
26