LTC3630 Datasheet, PDF (23/26 Pages) Linear Technology – High Efficiency, 65V 500mA Synchronous

LTC3630
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSE Package
Variation: MSE16 (12)
16-Lead Plastic MSOP with 4 Pins Removed
Exposed Die Pad
(Reference LTC DWG # 05-08-1871 Rev C)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 t 0.102
2.845 t 0.102
(.112 t .004)
0.889 t 0.127
(.112 t .004)
(.035 t .005)
1
8
0.35
REF
5.23
(.206)
MIN
1.651 t 0.102 3.20 – 3.45
(.065 t .004) (.126 – .136)
0.305 t 0.038
(.0120 t .0015)
TYP
0.50
(.0197)
1.0 _BSC
(.039)
BSC
RECOMMENDED SOLDER PAD LAYOUT
1.651 t 0.102
(.065 t .004)
0.12 REF
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
16
9
4.039 t 0.102
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
(.159 t .004)
(NOTE 3)
0.280 t 0.076
16 14 121110 9 ^{(.011 t .003)}
REF
0.254
(.010)
GAUGE PLANE
DETAIL “A”
0s – 6s TYP
4.90 t 0.152
(.193 t .006)
3.00 t 0.102
(.118 t .004)
(NOTE 4)
0.18
(.007)
0.53 t 0.152
(.021 t .006)
DETAIL “A”
1
1.10
(.043)
MAX
3 5678
1.0
(.039)
BSC
0.86
(.034)
REF
SEATING
PLANE _{0.17 – 0.27}
0.1016 t 0.0508
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
(.007 – .011)
TYP
0.50
(.0197)
BSC
(.004 t .002)
MSOP (MSE16(12)) 0911 REV C
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
3630fb
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