LTC3809-1_15 Datasheet, PDF (22/24 Pages) Linear Technology – No RSENSE, Low Input Voltage, Synchronous DC/DC Controller with Output Tracking

LTC3809-1
TYPICAL APPLICATIONS
220pF
15k
1.18k
Vx
118k
100pF
Synchronous DC/DC Converter with Output Tracking
1
MODE
6
IPRG
9
V_IN
8
TG
4 _ITH
LTC3809EDD-1
10
SW
V_IN
2.75V TO 8V
10μF
MP
Si7540DP
L
1.5μH
2 _TRACK/SS
590Ω
3
V_FB
59k
GND
11
7
BG
5
RUN
MN
Si7540DP
C_OUT ⁺
150μF
V_OUT
1.8V
(5A AT 5V_IN)
L: VISHAY IHLP-2525CZ-01
C_OUT: SANYO 4TPB150MC
V_OUT < Vx
38091 TA03
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 p0.05
R = 0.115
TYP
6
0.38 p 0.10
10
3.50 p0.05
1.65 p0.05
2.15 p0.05 (2 SIDES)
3.00 p0.10 1.65 p 0.10
(4 SIDES) (2 SIDES)
0.25 p 0.05
0.50
BSC
2.38 p0.05
(2 SIDES)
PIN 1
PACKAGE TOP MARK
OUTLINE (SEE NOTE 6)
0.200 REF
0.75 p0.05
0.00 – 0.05
(DD10) DFN 1103
5
1
0.25 p 0.05
0.50 BSC
2.38 p0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION
OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS
OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON
ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
38091fc
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