LTC3565_12 Datasheet, PDF (20/22 Pages) Linear Technology – 1.25A, 4MHz, Synchronous Step-Down DC/DC Converter

LTC3565
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev H)
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.88 ±0.102
(.074 ±.004)
0.889 ±0.127
1.88
1
(.074)
0.29
(.035 ±.005)
1.68
REF
(.066)
5.23
(.206)
MIN
1.68 ±0.102 3.20 – 3.45
(.066 ±.004) (.126 – .136)
0.305 ± 0.038
(.0120 ±.0015)
TYP
0.50
(.0197)
BSC
RECOMMENDED SOLDER PAD LAYOUT
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
0.05 REF
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
10
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
10 9 8 7 6
0.497 ±0.076
(.0196 ±.003)
REF
0.254
(.010)
GAUGE PLANE
DETAIL “A”
0° – 6° TYP
4.90 ±0.152
(.193 ±.006)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
12345
0.53 ±0.152
(.021 ±.006)
DETAIL “A”
1.10
(.043)
MAX
0.18
(.007)
SEATING
PLANE _{0.17 – 0.27}
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.007 – .011)
TYP
0.50
(.0197)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
0.86
(.034)
REF
0.1016 ±0.0508
(.004 ±.002)
MSOP (MSE) 0911 REV H
3565fb
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