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LTC3850_15 Datasheet, PDF (2/38 Pages) Linear Technology – Dual, 2-Phase Synchronous Step-Down Switching Controller
LTC3850/LTC3850-1
ABSOLUTE MAXIMUM RATINGS (Note 1)
Input Supply Voltage (VIN).......................... 28V to –0.3V
Input Supply Voltage (VIN),
LTC3850I Only........................................ 30V to –0.3V
Input Supply Transient Voltage (VIN) < 500ms, with
INTVCC ≥ 5V, LTC3850I Only.................... 34V to –0.3V
Top Side Driver Voltages
BOOST1, BOOST2................................... 34V to –0.3V
Switch Voltage (SW1, SW2).......................... 28V to –5V
Switch Voltage (SW1, SW2),
LTC3850I Only........................................... 30V to –5V
INTVCC, RUN1, RUN2, PGOOD, EXTVCC,
(BOOST1-SW1), (BOOST2-SW2).................. 6V to –0.3V
SENSE1+, SENSE2+, SENSE1–,
SENSE2– Voltages...................................... 5.5V to –0.3V
MODE/PLLIN, ILIM,TK/SS1,TK/SS2, FREQ/PLLFLTR
Voltages................................................. INTVCC to –0.3V
ITH1, ITH2, VFB1, VFB2 Voltages................... 2.7V to – 0.3V
INTVCC Peak Output Current.................................100mA
Operating Temperature Range (Note 2)....–40°C to 85°C
Junction Temperature (Note 3).............................. 125°C
Storage Temperature Range....................–65°C to 125°C
Lead Temperature (Soldering, 10 sec)
(GN Package)..................................................... 300°C
PIN CONFIGURATION
TOP VIEW
RUN1 1
SENSE1+ 2
SENSE1– 3
TK/SS1 4
ITH1 5
VFB1 6
SGND 7
VFB2 8
ITH2 9
TK/SS2 10
SENSE2– 11
SENSE2+ 12
RUN2 13
ILIM (EXTVCC)* 14
28 FREQ/PLLFLTR
27 MODE/PLLIN
26 SW1
25 TG1
24 BOOST1
23 BG1
22 VIN
21 INTVCC
20 BG2
19 PGND
18 BOOST2
17 TG2
16 SW2
15 PGOOD
GN PACKAGE
28-LEAD NARROW PLASTIC SSOP
TJMAX = 125°C, θJA = 95°C/W
*PIN 14 = ILIM FOR LTC3850GN, EXTVCC FOR LTC3850GN-1
TOP VIEW
TOP VIEW
28 27 26 25 24 23 22
TK/SS1 1
ITH1 2
VFB1 3
VFB2 4
ITH2 5
TK/SS2 6
SENSE2– 7
21 BOOST1
20 BG1
19 VIN
29
18 INTVCC
17 BG2
16 PGND
15 BOOST2
8 9 10 11 12 13 14
UF PACKAGE
28-LEAD (4mm × 4mm) PLASTIC QFN
TJMAX = 125°C, θJA = 37°C/W, θJC = 2.6°C/W
EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB
2
28 27 26 25 24 23
SENSE1– 1
22 BOOST1
TK/SS1 2
21 BG1
ITH1 3
20 VIN
VFB1 4
VFB2 5
29
19 INTVCC
18 BG2
ITH2 6
17 PGND
TK/SS2 7
SENSE2– 8
16 BOOST2
15 TG2
9 10 11 12 13 14
UFD PACKAGE
28-LEAD (4mm × 5mm) PLASTIC QFN
TJMAX = 125°C, θJA = 34°C/W, EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB
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