LT1078 Datasheet, PDF (19/20 Pages) Linear Technology – Micropower, Dual and Quad, Single Supply, Precision Op Amps

LT1078/LT1079
PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted.
0.040
(1.016)
MAX
SEATING
PLANE
0.010 – 0.045*
(0.254 – 1.143)
0.335 – 0.370
(8.509 – 9.398)
DIA
0.305 – 0.335
(7.747 – 8.509)
H Package
8-Lead TO-5 Metal Can (0.230 PCD)
(LTC DWG # 05-08-1321)
0.050
(1.270)
MAX
0.165 – 0.185
(4.191 – 4.699)
GAUGE
PLANE
0.500 – 0.750
(12.700 – 19.050)
REFERENCE
PLANE
45°TYP
0.027 – 0.034
(0.686 – 0.864)
0.016 – 0.021**
0.110 – 0.160
(0.406 – 0.533)
(2.794 – 4.064)
INSULATING
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE STANDOFF
AND 0.045" BELOW THE REFERENCE PLANE
**FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
0.016
(0.406
–
–
0.024
0.610)
0.027 – 0.045
(0.686 – 1.143)
0.200
(5.080)
TYP
H8(TO-5) 0.200 PCD 0595
J8 Package
8-Lead CERDIP (Narrow 0.300, Hermetic)
(LTC DWG # 05-08-1110)
CORNER LEADS OPTION
(4 PLCS)
0.300 BSC
(0.762 BSC)
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
0.008 – 0.018
(0.203 – 0.457)
0° – 15° _{0.045 – 0.068}
(1.143 – 1.727)
0.385 ± 0.025
(9.779 ± 0.635)
0.014 – 0.026
(0.360 – 0.660)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE OR TIN PLATE LEADS.
0.200
(5.080)
MAX
0.015 – 0.060
(0.381 – 1.524)
0.005
(0.127)
MIN
0.025
(0.635)
RAD TYP
0.125
3.175
0.100 ± 0.010 ^MIN
(2.540 ± 0.254)
0.405
(10.287)
MAX
8
7
65
0.220 – 0.310
(5.588 – 7.874)
1
2
3
4
J8 0694
0.300 BSC
(0.762 BSC)
J Package
14-Lead CERDIP (Narrow 0.300, Hermetic)
(LTC DWG # 05-08-1110)
0.200
(5.080)
MAX
0.015 – 0.060
(0.381 – 1.524)
0.005
(0.127)
MIN
0.785
(19.939)
MAX
14 13 12 11 10 9
8
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
0.385 ± 0.025
(9.779 ± 0.635)
0.045 – 0.068
(1.143 – 1.727)
0.014 – 0.026
(0.360 – 0.660)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.
0.100 ± 0.010
(2.540 ± 0.254)
0.025
(0.635)
RAD TYP
0.125
(3.175)
MIN
0.220 – 0.310
(5.588 – 7.874)
1
2
3
4
5
6
7
J14 0996
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19