LTC3619B_15 Datasheet, PDF (18/20 Pages) Linear Technology – 400mA/800mA Synchronous Step-Down DC/DC with Average Input Current Limit

LTC3619B
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
0.70 ±0.05
R = 0.125
TYP
6
0.40 ±0.10
10
3.55 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
0.25 ±0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
PACKAGE
OUTLINE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
3.00 ±0.10 1.65 ±0.10
(4 SIDES) (2 SIDES)
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
0.75 ±0.05
(DD) DFN REV C 0310
5
1
0.25 ±0.05
0.50 BSC
0.00 – 0.05
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev H)
1.88 ±0.102
(.074 ±.004)
0.889 ±0.127
(.035 ±.005)
BOTTOM VIEW OF EXPOSED PAD OPTION
1.88
1
(.074)
0.29
1.68
REF
(.066)
5.23
(.206)
MIN
1.68 ±0.102 3.20 – 3.45
(.066 ±.004) (.126 – .136)
0.305 ± 0.038
(.0120 ±.0015)
TYP
0.50
(.0197)
BSC
RECOMMENDED SOLDER PAD LAYOUT
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
0.05 REF
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
10
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
10 9 8 7 6
0.497 ±0.076
(.0196 ±.003)
REF
18
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.90 ±0.152
(.193 ±.006)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
GAUGE PLANE
0.53 ±0.152
(.021 ±.006)
1.10
(.043)
MAX
12345
0.86
(.034)
REF
DETAIL “A”
0.18
(.007)
SEATING
PLANE _{0.17 – 0.27}
(.007 – .011)
TYP
0.50
(.0197)
0.1016 ±0.0508
(.004 ±.002)
MSOP (MSE) 0911 REV H
BSC
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
2. DRAWING NOT TO SCALE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS 6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.152mm (.006") PER SIDE
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
3619bfb