English
Language : 

LTC3622-2_15 Datasheet, PDF (17/24 Pages) Linear Technology – 17V, Dual 1A Synchronous Step-Down Regulator with Ultralow Quiescent Current
LTC3622/
LTC3622-2/LTC3622-23/5
Applications Information
Board Layout Considerations
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3622 (refer to Figure 3). Check the following in
the layout:
1. Do the capacitors CIN connect to the VIN and GND as
close as possible? These capacitors provide the AC
current to the internal power MOSFETs and their driv-
ers. Does CVCC connect to INTVCC as close as possible?
2. Are COUT and L closely connected? The (–) plate of
COUT returns current to GND and the (–) plate of CIN.
3. The resistive divider, R1 and R2, must be connected
between the (+) plate of COUT and a ground line ter-
minated near GND. The feedback signal VFB should be
routed away from noisy components and traces, such
as the SW line, and its trace should be minimized. Keep
R1 and R2 close to the IC.
4. Solder the exposed pad (Pin 15 for DFN, Pin 17 for
MSOP) on the bottom of the package to the GND plane.
Connect this GND plane to other layers with thermal
vias to help dissipate heat from the LTC3622.
5. Keep sensitive components away from the SW pin. The
input capacitor, CIN, feedback resistors, and INTVCC
bypass capacitors should be routed away from the SW
trace and the inductor.
6. A ground plane is highly recommended.
7. Flood all unused areas on all layers with copper, which
reduces the temperature rise of power components.
These copper areas should be connected to GND.
VIN
GND
L1
CIN
SW1
COUT1
VIAS TO
GROUND
PLANE
VIAS TO
GROUND
PLANE
CIN
SW2
L2
VIN
GND
COUT2
VIAS TO
GROUND
PLANE
Figure 3. Layout Diagram
36222 F03
For more information www.linear.com/LTC3622
3622fa
17