LTC3548-1 Datasheet, PDF (15/16 Pages) Linear Technology – Dual Synchronous, Fixed Output 2.25MHz Step-Down DC/DC Regulator

PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ±0.05
LTC3548-1
R = 0.115
TYP
6
0.38 ± 0.10
10
3.50 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(SEE NOTE 6)
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3.00 ±0.10 1.65 ± 0.10
(4 SIDES) (2 SIDES)
0.75 ±0.05
0.00 – 0.05
(DD) DFN 1103
5
1
0.25 ± 0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
KD Package
10-Lead Plastic UTDFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1739 Rev Ø)
2.00 REF
0.675 ±0.05
3.00 ±0.10
R = 0.05
TYP
2.00 REF
0.40 ± 0.10
6
10
3.50 ±0.05
2.15 ±0.05
2.38 ±0.05
1.65 ±0.05
PIN 1
PACKAGE _{TOP MARK}
OUTLINE _{(SEE NOTE 6)}
0.25 ± 0.05
0.50 BSC
0.125 REF
3.00 ±0.10
0.55 ±0.05
2.38 ±0.10
1.65 ± 0.10
5
R = 0.115
TYP
(KD10) UTDFN 1106 REV Ø
1
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE VARIATION OF (TBI).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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