LTC3261_15 Datasheet, PDF (12/14 Pages) Linear Technology – High Voltage, Low Quiescent Current Inverting Charge Pump

LTC3261
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSE Package
12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev F)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ± 0.102
2.845 ± 0.102
(.112 ± .004)
0.889 ± 0.127
(.112 ± .004)
(.035 ± .005)
1
6
0.35
REF
5.23
(.206)
MIN
1.651 ± 0.102 3.20 – 3.45
(.065 ± .004) (.126 – .136)
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
1.651 ± 0.102
(.065 ± .004)
0.12 REF
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
12
7
4.039 ± 0.102
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
(.159 ± .004)
(NOTE 3)
0.406 ± 0.076
12 11 10 9 8 7
(.016 ± .003)
REF
0.254
(.010)
GAUGE PLANE
DETAIL “A”
0° – 6° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.18
(.007)
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
1.10
(.043)
MAX
1 23 456
0.86
(.034)
REF
SEATING
PLANE _{0.22 – 0.38}
0.1016 ± 0.0508
NOTE:
(.009 – .015)
TYP
0.650
(.0256)
(.004 ± .002)
MSOP (MSE12) 0911 REV F
1. DIMENSIONS IN MILLIMETER/(INCH)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
12
For more information www.linear.com/3261
3261fb