LT1001 Datasheet, PDF (12/12 Pages) Linear Technology – Precision Operational Amplifier

LT1001
SCHE ATIC DIAGRA
V+
7
6k
6k
1
8
Q27
40k
40k
Q28
Q5
Q6
Q7
Q3
Q8
Q4
Q29
Q11 Q13 Q14 Q12
Q24
1.5k
25k
3k
55pF
20pF
+ ₅₀₀
3
– ₅₀₀
2
Q1A Q1B
Q2B Q2A
Q10
Q9
V^–
4
30pF
3k
T1
180Ω Q20
Q15
2k
Q17
Q19
Q16
2k
Q18
Q21
Q22
Q30
8k 120Ω
Q25
Q33
Q26
Q34
Q23
240Ω
Q31
20Ω
OUT
6
20Ω
Q32
1001 SS
PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted.
H Package
8-Lead TO-5 Metal Can (0.200 PCD)
(LTC DWG # 05-08-1320)
J8 Package
8-Lead CERDIP (Narrow 0.300, Hermetic)
(LTC DWG # 05-08-1110)
N8 Package
8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
0.040
(1.016)
MAX
SEATING
PLANE
0.010 – 0.045*
(0.254 – 1.143)
0.335 – 0.370
(8.509 – 9.398)
DIA
0.305 – 0.335
(7.747 – 8.509)
0.050
(1.270)
MAX
0.165 – 0.185
(4.191 – 4.699)
GAUGE
PLANE
0.500 – 0.750
(12.700 – 19.050)
REFERENCE
PLANE
0.016 – 0.021**
(0.406 – 0.533)
45°TYP
0.027 – 0.034
(0.686 – 0.864)
0.027 – 0.045
(0.686 – 1.143)
0.200
(5.080)
TYP
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
H8(TO-5) 0.200 PCD 0595
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
**FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
0.016
(0.406
–
–
0.024
0.610)
CORNER LEADS OPTION
(4 PLCS)
0.005
(0.127)
MIN
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
0.025
(0.635)
RAD TYP
0.300 BSC
(0.762 BSC)
0.405
(10.287)
MAX
8
7
65
0.220 – 0.310
(5.588 – 7.874)
1
2
3
4
0.200
(5.080)
MAX
0.015 – 0.060
(0.381 – 1.524)
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
0.385 ± 0.025
(9.779 ± 0.635)
0.045 – 0.068
(1.143 – 1.727)
0.014 – 0.026
(0.360 – 0.660)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE OR TIN PLATE LEADS.
T_jmax
θ_ja
150°C 100°C/W
0.125
3.175
0.100 ± 0.010 ^MIN
(2.540 ± 0.254)
J8 0694
0.400*
(10.160)
MAX
8
7
6
5
0.255 ± 0.015*
(6.477 ± 0.381)
0.300 – 0.325
(7.620 – 8.255)
12
0.045 – 0.065
(1.143 – 1.651)
34
0.130 ± 0.005
(3.302 ± 0.127)
0.009 – 0.015
(0.229 – 0.381)
+0.025
0.325 _–0.015
( ) ^8.255
+0.635
–0.381
0.065
(1.651)
TYP
0.005
(0.127)
MIN
0.100 ± 0.010
(2.540 ± 0.254)
0.125
(3.175)
MIN
0.015
(0.380)
MIN
0.018 ± 0.003
(0.457 ± 0.076)
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
N8 0695
T_jmax
θ_ja
150°C 130°C/W
T_jmax
θ_ja
θ_jc
150°C 150°C/W 45°C/W
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
0.010
(0.254
–
–
0.020
0.508)
×
45°
0.008 – 0.010
(0.203 – 0.254)
(LTC DWG # 05-08-1610)
0.053 – 0.069
(1.346 – 1.752)
0°– 8° TYP
0.004 – 0.010
(0.101 – 0.254)
0.189 – 0.197*
(4.801 – 5.004)
8
7
6
5
0.016 – 0.050
0.406 – 1.270
0.014 – 0.019
(0.355 – 0.483)
0.050
(1.270)
BSC
0.228 – 0.244
(5.791 – 6.197)
0.150 – 0.157**
(3.810 – 3.988)
T_jmax
θ_ja
150°C 150°C/W
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
1
2
34
SO8 0695
12 Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
[phone] ^q FAX: [phone] ^q TELEX: 499-3977
LT/GP 0396 2K REV A • PRINTED IN USA
© LINEAR TECHNOLOGY CORPORATION 1983