LTC3459_07 Datasheet, PDF (11/12 Pages) Linear Technology – 10V Micropower Synchronous Boost Converter

LTC3459
PACKAGE DESCRIPTION
DCB Package
6-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1715)
0.70 ±0.05
2.00 ±0.10
(2 SIDES)
R = 0.115
R = 0.05
TYP
TYP
4
0.40 ± 0.10
6
3.55 ±0.05
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
PACKAGE
OUTLINE
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.25 ± 0.05
0.50 BSC
1.35 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD
PITCH AND DIMENSIONS
0.200 REF
3.00 ±0.10
(2 SIDES)
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
PIN 1 NOTCH
R0.20 OR 0.25
× 45° CHAMFER
3
1
(DCB6) DFN 0405
0.25 ± 0.05
0.50 BSC
1.35 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.62
0.95
MAX
REF
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
1.22 REF
2.90 BSC
(NOTE 4)
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC ^{1.50 – 1.75}
(NOTE 4)
PIN ONE ID
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.95 BSC
0.80 – 0.90
1.00 MAX
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
0.09 – 0.20
(NOTE 3)
1.90 BSC
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.30 – 0.45
6 PLCS (NOTE 3)
0.01 – 0.10
S6 TSOT-23 0302 REV B
3459fc
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