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LTC3424_15 Datasheet, PDF (11/12 Pages) Linear Technology – Low Output Voltage, 3MHz Micropower Synchronous Boost Converters
LTC3423/LTC3424
TYPICAL APPLICATIO
Single Cell to 1.8V at 300mA, 1.8mm High
VDD
IN
C1
2.2µF
VDD = 2.7V TO 5.5V
VIN = 0.9V TO 1.5V
+
1
– CELL
C2
4.7µF
L1
4.7µH
LTC3423
6
4
VDD
SW
10
SHDN
7
VOUT
3
VIN
8
FB
2
9
MODE/SYNC VC
1
Rt
GND 5
Rt fOSC = 1MHz
30.1k
D1
C4
470pF
RC
82k
R1
110k
R2
C5 249k
4.7pF
VOUT
1.8V
300mA
C3
22µF
0 = FIXED FREQ
1 = Burst Mode OPERATION
C1: TAIYO YUDEN JMK212BJ225MG
C2: TAIYO YUDEN JMK212BJ475MM
C3: TAIYO YUDEN JMK325BJ226MM
D1: ON SEMICONDUCTOR MBRM120T3
L1: SUMIDA CDRH3D16-4R7M
3423/24 TA04
PACKAGE DESCRIPTIO
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
0.889 ± 0.127
(.035 ± .005)
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
3.05 ± 0.38
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
RECOMMENDED SOLDER PAD LAYOUT
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
10 9 8 7 6
0.497 ± 0.076
(.0196 ± .003)
REF
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.88 ± 0.10
(.192 ± .004)
3.00 ± 0.102
(.118 ± .004)
NOTE 4
GAUGE PLANE
12345
0.18
(.007)
0.53 ± 0.01
(.021 ± .006)
DETAIL “A”
1.10
(.043)
MAX
0.86
(.034)
REF
SEATING
PLANE 0.17 – 0.27
(.007 – .011)
0.50
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.0197)
TYP
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.13 ± 0.05
(.005 ± .002)
MSOP (MS) 1001
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
34234f
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