LTC3808 Datasheet, PDF (26/28 Pages) Linear Technology – No RSENSE TM, Low EMI, Synchronous DC/DC Controller with Output Tracking

LTC3808
PACKAGE DESCRIPTIO
DE Package
14-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1708)
0.65 ±0.05
3.50 ±0.05
1.70 ±0.05
2.20 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
3.30 ±0.05
(2 SIDES)
0.25 ± 0.05
0.50
BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ±0.10
(2 SIDES)
8
R = 0.20
TYP
R = 0.115
TYP
0.38 ± 0.10
14
3.00 ±0.10
(2 SIDES)
1.70 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.75 ±0.05
0.00 – 0.05
PIN 1
NOTCH
(DE14) DFN 1203
7
1
0.25 ± 0.05
0.50 BSC
3.30 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3808f
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