EQW025A0P1 Datasheet, PDF (23/25 Pages) Lineage Power Corporation – 36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output

Data Sheet
December 12, 2008
EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
Surface Mount Information (continued)
Tin Lead Soldering
The recommended linear reflow profile using Sn/Pb
solder is shown in Figure 49 and 50. For reliable
soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
300
P eak Temp 235^oC
250
Co o ling
Heat zo ne
200
max 4^oCs^-1
zo ne
1-4^oCs^-1
150
So ak zo ne
100
30-240s
T_lim above
205^oC
50
P reheat zo ne
max 4^oCs^-1
0
REFLOW TIME (S)
Figure 49. Recommended Reflow Profile for Sn/Pb
Solder.
240
235
230
225
220
215
210
205
200
0
10
20
30
40
50
60
TIME LIMIT (S)
Figure 50. Time Limit, Tlim, Curve Above 205^oC
Reflow .
Lead Free Soldering
The –Z version SMT modules of EQW series are
lead-free (Pb-free) and RoHS compliant and are
compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the
failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
LINEAGE POWER
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 51.
300
Per J-STD-020 Rev. C
Peak Temp 260°C
250
200
150
Heating Zone
1°C/Se cond
100
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
50
0
Reflow Time (Seconds)
Figure 51. Recommended linear reflow profile
using Sn/Ag/Cu solder.
MSL Rating
The EQW series SMT modules have a MSL rating of
2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
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