JHW050FG Datasheet, PDF (12/17 Pages) Lineage Power Corporation – JHW050 Dual Positive Output-Series Power Modules dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs 50W

JHW050 Dual Positive Output-Series Power Modules: dc-dc
Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
EMC Considerations
The Figure 25 shows a suggested configuration to
meet the conducted emission limits of EN55022
Class B.
Data Sheet
April 2008
Note:
1-0870
Inductor L1 must not be > 1 uH to ensure stability C1, C2 should be low impedance
type, ESR < 0.7Ω
Figure 25.Suggested Configuration for EN55022
Class B
1-0871
Figure 26.Typical EMC signature using Figure 25
filter.
For further information on designing for EMC compli-
ance, please refer to the FLTR100V10 data sheet
(FDS01-043EPS).
Layout Considerations
Though the external filter components are important in
achieving a good EMC result, equally important is the
PCB layout and system grounding configuration.
The JHW050 power module is low profile in order to be
used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited.
12
1-0872
Figure 27. Suggested Primary to Secondary Power
Planes
The following recommendations should ensure reliable
operation of the power module:
n Due to the limited component clearance avoid plac-
ing copper areas on the outer layer directly under-
neath the power module. Also avoid placing via
interconnects underneath the power module. If this is
not possible, any vias should be situated away from
the three main magnetic components, as shown
above. These components are the highest on the
power module bottom side and hence provide the
least clearance to the system card.
n Two planes should be provided beneath the power
module to minimize radiated emissions. The ‘Input
Plane’ should be sized to cover the primary-side cir-
cuits of the power module, and it should be con-
nected to either of the input power pins e.g. VI(+).
The ‘Output Plane’ should be sized to cover the sec-
ondary-side circuits and it should be connected to
either of the output power pins e.g. 0V. Proper sepa-
ration, in accordance with safety agency standards
should be provided between these two planes. the
spacing distance of 2mm shown above preserves
the maximum Basic Insulation classification of these
power modules.
n Under no circumstances should unconnected or
‘Floating ‘copper areas be placed underneath the
power module as these can transmit noise signals,
which could reduce module stability.
n Avoid routing sensitive data signals beneath the
power module. If this is not possible, these signal
traces should be shielded by use of ground planes.
For additional layout guidelines, please refer to the
FLTR100V10 data sheet (FDS01-043EPS).
Lineage Power