NSR050A0X432Z Datasheet, PDF (11/15 Pages) Lineage Power Corporation – Naos Raptor 50A: Non-Isolated Power Modules

Data Sheet
February 3, 2010
Naos Raptor 50A: Non Isolated Power Module:
5 – 14Vdc input; 0.6Vdc to 2.0Vdc Output; 50A output current
VOUT
SENSE+
MODULE
TRIM+
TRIM-
RTune
CTune
RTrim
Figure. 25. Circuit diagram showing connection of
RTUME and CTUNE to tune the control loop of the
module.
Table 2. Recommended values of RTUNE and CTUNE
to obtain transient deviation of 2% of Vout for a
25A step load with Vin=12V.
Vout
Cext
RTUNE
CTUNE
ΔV
1.8V
3x47μF
+
7x330uF
Polymer
47
22nF
35mV
1.2V
12x330uF
Polymer
39
100nF
23mV
0.6V
2x47μF
+
24x330uF
Polymer
33
330nF
12mV
Table 3. General recommended values of of RTUNE
and CTUNE for Vin=12V and various external
ceramic capacitor combinations.
Cext 2x47μF 4x47μF 10x47μF 20x47μF 40x47μF
RTUNE Open Open
47
39
33
CTUNE Open Open 3900pF 10nF
22nF
LINEAGE POWER
Thermal Considerations
Power modules operate in a variety of thermal
environments; however sufficient cooling should
always be provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel. The test set-
up is shown in Figure 26. The preferred airflow
direction for the module is in Figure 27.
Wind Tunnel
PWBs
50.8
[2.00]
Power Module
76.2
[3.0]
7.24
[0.285]
Probe Location
for measuring
airflow and
ambient
temperature
Air
Flow
Figure 26. Thermal Test Set-up.
The thermal reference points, Tref1 and Tref2 used in
the specifications are shown in Figure 27. For reliable
o1p2e0r_oaCt,ioanndthtehetetmempepreartautruereataTt r_Tef1refs₂hsohuolduldnontoetxecxeceeded
105 ^oC. Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
The output power of the module should not exceed
the rated power of the module (Vo,set x Io,max).
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
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