MK71251-01 Datasheet, PDF (1/29 Pages) LAPIS Semiconductor Co., Ltd. – Bluetooth Smart wireless module

MK71251-01/MK71251-02
Bluetooth^ Smart wireless module
FEDK71251-01
Issue Date：Apr,27,2016
■ Overview
MK71251-01/-02 is a Bluetooth® Smart wireless module which is integrating Bluetooth® SIG Core Spec v4.1
compliant LSI (ML7125-001/-002), E2PROM,26MHz/32.768kHz crystal oscillator, 2.4GHz PCB pattern antenna
and passive components.
MK71251-01/-02 is suitable for applications such as Healthcare, fitness device, Remote Controller or PC
peripherals.
■ Features
 Bluetooth® SIG Core Spec v4.1 compliant
 Radio certification
MIC JAPAN（certification no: 006-000373[MK71251-01] / 006-000384[MK71251-02]）
FCC (FCC ID:2ACIJ71251)
IC(IC: 20971-K71251)
CE/R&TTE
 Bluetooth® Qualification（End Product, QDID:77987）
 Integrating Bluetooth® SIG Core Spec v4.1 compliant LSI (ML7125-001/ML7125-002)
 Integrating 26MHz/32.768kHz crystal oscillator
 Integrating 128kbit EEPROM
 Integrating bypass capacitor and external component of switching regulator
 Integrating 2.4GHz PCB pattern antenna and passive components
 Single power supply 2.0V to 3.6V
 Operating Temperature
-20 deg.C to 75 deg.C
 Current Consumptions
Deep Sleep Mode
3.15μA(Typ.)
Idle Mode
2.0 mA(Typ.)
Active TX
6.7 mA(Typ.)
Active RX
6.2 mA(Typ.)
 Dimension: 8.0mm (W) x 11.0mm (L) x 2.0mm (H)
 Pb Free, RoHS compliant
 Product Name (*1) MK71251-01YEZ05B (which is integrating ML7125-001)
MK71251-02YEZ05B(which is integrating ML7125-002)------- Application Blank (*2)------
【Note】
(*1) MK71251-01 and MK71251-02 are different only BLE LSI that are mounted.
Please refer to the ML7125 datasheet about the difference between ML7125-001 and ML7125-002.
(*2) You need to write the application data in accordance with the operation mode to the EEPROM.
For more information, please refer to the separate section “How to write application data”.
•Bluetooth^® is a registered trademark of Bluetooth SIG, Inc.
•All other company and product names are the trademarks or registered trademarks of the respective companies.
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