CM32Y5V106Z16AT Datasheet, PDF (16/16 Pages) Kyocera Kinseki Corpotation – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Soldering Method
1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference
(Delta T) to within 130 degree Celsius.
2) The product size 1.0×0.5mm to 3.2×1.6mm can be used in reflow and wave soldering, and the product size of over 3.2×2.5mm, 0.6×0.3mm, and
capacitor arrays can be used in reflow.
Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution.
3) Please see our recommended soldering conditions.
Please contact us if you use lead free solder because the peak temperature of lead free is different from non-lead free.
Recommendable Temperature Profile(62Sn Solder)
Reflow
300
250
200
150
100
50
0
Preheat
∆T
Peak temperature
230°C±5°C
15seconds maximum
Cool at normal room
temperature after
removing from
furnace.
More than180°C,
40seconds maximum
60seconds
60seconds
q Minimize soldering time.
w Ensure that allowable temperature difference does not exceed 130˚C.
Wave
300
Preheat
250
Cool at normal
room temperature
200
∆T
230°C
to
150
260°C
100
50
0
60 to 120sec.
3sec. max
Recommendable Temperature Profile(Sn-3Ag-0.5Cu)
Reflow
300
Preheat
250
200
1 to 3°C/sec.
150
100
50
0
170 to 180°C
250°C±5°C
5 to 10sec. Max.
220°C Max.
90±30sec.
q Minimize soldering time.
w Ensure that allowable temperature difference does not exceed 130˚C.
Wave
300
245 to 260˚C
250
;;;;;;; ₂₀₀
∆T
;;;;;;; 150
100
;;;;;;;;;;;;;; ^Preheat
90±30sec.
q Ensure that the chip capacitor is preheated adequately.
w Ensure that the temperature difference (∆T) does not exceed 150°C.
e Cool naturally after soldering.
r Stop wave in more than CM32.
q Ensure that the chip capacitor is preheated adequately.
w Ensure that the temperature difference (∆T) does not exceed 150°C.
e Cool naturally after soldering.
Sodering iron
1) Temperature of iron chip
2) Wattage
3) Tip shape of soldering iron
4) Soldering Time
350°C max
30W max
φ3.0mm max
3sec. max
5) Cautions
a) Pre-heating is necessary Rapid heating must be avoided.
Delta T≤130˚C.
b) Avoid direct touching to capacitors.
c) Avoid rapid cooling after soldering. Natural cooling is recommended.