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AO3418 Datasheet, PDF (2/4 Pages) List of Unclassifed Manufacturers – N-Channel Enhancement Mode Field Effect Transistor
Electrical Characteristics (TJ=25°C unless otherwise noted)
KSM3418,KSM3418L
Symbol
Parameter
Conditions
Min
STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage
ID=250µA, VGS=0V
30
IDSS
Zero Gate Voltage Drain Current
VDS=24V, VGS=0V
TJ=55°C
IGSS
Gate-Body leakage current
VDS=0V, VGS=±12V
VGS(th) Gate Threshold Voltage
VDS=VGS ID=250µA
1
ID(ON)
On state drain current
VGS=4.5V, VDS=5V
15
VGS=10V, ID=3.8A
RDS(ON) Static Drain-Source On-Resistance
VGS=4.5V, ID=3.5A
TJ=125°C
VGS=2.5V, ID=1A
gFS
Forward Transconductance
VDS=5V, ID=3.8A
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
trr
Qrr
Total Gate Charge
Gate Source Charge
VGS=4.5V, VDS=15V, ID=3.8A
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
VGS=10V, VDS=15V, RL=3.9Ω,
RGEN=6Ω
Turn-Off Fall Time
Body Diode Reverse Recovery Time IF=3.8A, dI/dt=100A/µs
Body Diode Reverse Recovery Charge IF=3.8A, dI/dt=100A/µs
Typ
0.001
1.4
43
64
52
101
11.7
0.81
226
39
29
1.4
3
1.4
0.55
2.6
3.2
14.5
2.1
10.2
3.8
Max
1
5
100
1.8
60
85
70
155
1
2.5
270
1.7
3.6
4
5
22
3
13
5
Units
V
µA
nA
V
A
mΩ
mΩ
mΩ
S
V
A
pF
pF
pF
Ω
nC
nC
nC
ns
ns
ns
ns
ns
nC
A: The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any a given application depends on the user's specific board design. The current rating is based on the t≤ 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
2014-5-29
2
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