IRFR9120N Datasheet, PDF (1/10 Pages) Kersemi Electronic Co., Ltd. – Ultra Low On-Resistance

IRFR/U9120N
l Ultra Low On-Resistance
l P-Channel
l Surface Mount (IRFR9120N)
l Straight Lead (IRFU9120N)
l Advanced Process Technology
l Fast Switching
l Fully Avalanche Rated
D -P ak
T O -2 52 A A
I-P a k
TO -251AA
Description
The D-Pak is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU series) is for through-hole mounting
applications. Power dissipation levels up to 1.5 watts are
possible in typical surface mount applications.
G
Absolute Maximum Ratings
I_D @ T_C = 25°C
I_D @ T_C = 100°C
I_DM
P_D @T_C = 25°C
V_GS
E_AS
I_AR
E_AR
dv/dt
T_J
T_STG
Parameter
Continuous Drain Current, V_GS @ -10V
Continuous Drain Current, V_GS @ -10V
Pulsed Drain Current 
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt ƒ
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Thermal Resistance
Parameter
R_θJC
R_θJA
R_θJA
Junction-to-Case
Junction-to-Ambient (PCB mount)**
Junction-to-Ambient
2014-8-14
1
D
V_DSS = -100V
R_DS(on) = 0.48Ω
I_D = -6.6A
S
Max.
-6.6
-4.2
-26
40
0.32
± 20
100
-6.6
4.0
-5.0
-55 to + 150
300 (1.6mm from case )
Units
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
Typ.
–––
–––
–––
Max.
3.1
50
110
Units
°C/W
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