IRFR024N Datasheet, PDF (1/10 Pages) Kersemi Electronic Co., Ltd. – Ultra Low On-Resistance

l Ultra Low On-Resistance
l Surface Mount (IRFR024N)
l Straight Lead (IRFU024N)
l Advanced Process Technology
l Fast Switching
l Fully Avalanche Rated
IRFR/U024N
D -P ak
T O -2 52 A A
I-P a k
TO -251AA
Description
The D-PAK is designed for surface mounting
using vapor phase, infrared, or wave soldering
techniques. The straight lead version (IRFU series)
is for through-hole mounting applications.
G
Power dissipation levels up to 1.5 watts
are possible in typical surface mount applications.
Absolute Maximum Ratings
I_D @ T_C = 25°C
I_D @ T_C = 100°C
I_DM
P_D @T_C = 25°C
V_GS
E_AS
I_AR
E_AR
dv/dt
T_J
T_STG
Parameter
Continuous Drain Current, V_GS @ 10V
Continuous Drain Current, V_GS @ 10V
Pulsed Drain Current †
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚†
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt Ġ
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Thermal Resistance
R_θJC
R_θJA
R_θJA
Parameter
Junction-to-Case
Case-to-Ambient (PCB mount)**
Junction-to-Ambient
2014-8-15
1
D
V_DSS = 55V
R_DS(on) = 0.075Ω
I_D = 17A…
S
Max.
17
12
68
45
0.30
± 20
71
10
4.5
5.0
-55 to + 175
300 (1.6mm from case )
Units
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
Typ.
–––
–––
–––
Max.
3.3
50
110
Units
°C/W
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