C0402C100J5GAC Datasheet, PDF (8/18 Pages) Kemet Corporation – Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G Dielectric, 10 – 200 VDC (Commercial Grade)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
0201
0402
0603
0805
1206
1210
1210¹
1808
1812
1825
2220
2225
Metric
Size
Code
0603
1005
1608
2012
3216
3225
3225
4520
4532
4564
5650
5664
Density Level A:
Maximum (Most)
Land Protrusion (mm)
C
Y
X
V1 V2
0.38 0.56 0.52 1.80 1.00
0.50 0.72 0.72 2.20 1.20
0.90 1.15 1.10 4.00 2.10
1.00 1.35 1.55 4.40 2.60
1.60 1.35 1.90 5.60 2.90
1.60 1.35 2.80 5.65 3.80
1.50 1.60 2.90 5.60 3.90
2.30 1.75 2.30 7.40 3.30
2.15 1.60 3.60 6.90 4.60
2.15 1.60 6.90 6.90 7.90
2.75 1.70 5.50 8.20 6.50
2.70 1.70 6.90 8.10 7.90
Density Level B:
Median (Nominal)
Land Protrusion (mm)
C
Y
X
V1 V2
0.33 0.46 0.42 1.50 0.80
0.45 0.62 0.62 1.90 1.00
0.80 0.95 1.00 3.10 1.50
0.90 1.15 1.45 3.50 2.00
1.50 1.15 1.80 4.70 2.30
1.50 1.15 2.70 4.70 3.20
1.40 1.40 2.80 4.70 3.30
2.20 1.55 2.20 6.50 2.70
2.05 1.40 3.50 6.00 4.00
2.05 1.40 6.80 6.00 7.30
2.65 1.50 5.40 7.30 5.90
2.60 1.50 6.80 7.20 7.30
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1 V2
0.28 0.36 0.32 1.20 0.60
0.40 0.52 0.52 1.60 0.80
0.60 0.75 0.90 2.40 1.20
0.75 0.95 1.35 2.80 1.70
1.40 0.95 1.70 4.00 2.00
1.40 0.95 2.60 4.00 2.90
1.30 1.20 2.70 4.00 3.00
2.10 1.35 2.10 5.80 2.40
1.95 1.20 3.40 5.30 3.70
1.95 1.20 6.70 5.30 7.00
2.55 1.30 5.30 6.60 5.60
2.50 1.30 6.70 6.50 7.00
1 _{Only for capacitance values ≥ 22 µF}
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Soldering Profile:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
C1003_C0G • 11/20/2013 8