C0201C103B1GA Datasheet, PDF (4/8 Pages) Kemet Corporation – CERAMIC CHIP CAPACITORS

CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
g
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Anti-Static Reel
®
KEMET
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
178mm (7.00")
or
330mm (13.00")
8mm ±.30
(.315 ±.012")
or
12mm ±.30
(.472 ±.012")
Embossment
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
* Punched paper carrier used for 0402 and 0603 case size.
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
pGlacGrei^rmd^ident
c_Pou_larty_ca_erd_ment
Courtyard_C
C
X_X
Reflow Solder
Dimension Z G
0402
2.14 0.28
0603
2.78 0.68
0805
3.30 0.70
1206
4.50 1.50
1210
4.50 1.50
1812
5.90 2.30
1825
5.90 2.30
2220
7.00 3.30
2225
7.00 3.30
X Y(ref) C(ref)
0.74 0.93 1.21
1.08 1.05 1.73
1.60 1.30 2.00
2.00 1.50 3.00
2.90 1.50 3.00
3.70 1.80 4.10
6.90 1.80 4.10
5.50 1.85 5.15
6.80 1.85 5.15
Z
3.18
3.70
4.90
4.90
Wave Solder
G X Y(ref)
Not Recommended
0.68 0.80 1.25
0.70 1.10 1.50
1.50 1.40 1.70
1.50 2.00 1.70
Smin
1.93
2.20
3.20
3.20
Not Recommended
Calculation Formula
G^G _Y
Z = Lmin + 2Jt + Tt
Y
Z^Z
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, [phone]
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