EXV226M6R3A9BAA Datasheet, PDF (15/18 Pages) Kemet Corporation – Surface Mount Aluminum Electrolytic Capacitors

Surface Mount Aluminum Electrolytic Capacitors – EXV Series, +105°C
Soldering Process
The soldering conditions should be within the specified conditions below:
Do not dip the capacitors body into the melted solder. Flux should only be applied to the capacitors terminals
T3
T32
Pre-heat
T1
T0
Time (seconds)
Vapour heat transfer systems are not recommended.
The system should be thermal, such as infra-red radiation or hot blast
Observe the soldering conditions as shown below.
Do not exceed these limits and avoid repeated reflowing
Reflow Soldering
T0
Pre-heat
T1
T2
T3
Temperature (°C)
20 to 140
140 to 180
180 to 140
> 200
230
Maximum Time
(Seconds)
60
150
100
60
20
Lead Free Reflow Soldering
T0
Pre-heat
T1
T2
Temperature (°C)
20 to 160
160 to 190
190 to 180
> 220
Maximum Time
(Seconds)
60
120
90
60
Lead Free Reflow Soldering cont'd.
Size
Temperature Maximum Time
(^°C)
(Seconds)
250
10
T3 Φ4 ~ Φ5 (4 – 50 V)
260
5
Φ6.3 ~ Φ10 (4 – 50 V)
250
5
Φ4 ~ Φ10 (63 – 100 V)
250
5
Size
Temperature Maximum Time
(°C)
(Seconds)
Φ4 ~ Φ5
250
10
(4 – 50 V)
260
5
T3
Φ6.3 ~ Φ10
(4 – 50 V)
250
5
Φ4 ~ Φ10
(63 – 100 V)
250
5
≥ Φ12.5
250
5
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
A4003_EXV • 12/2/2016 15