EEV107M035A9HAA Datasheet, PDF (12/16 Pages) Kemet Corporation – Surface Mount Aluminum Electrolytic Capacitors EEV Series, +105ºC

Surface Mount Aluminum Electrolytic Capacitors – EEV Series, +105ºC
Soldering Process
The soldering conditions should be within the specified conditions below:
Do not dip the capacitors body into the melted solder. Flux should only be applied to the capacitors terminals
Vapour heat transfer systems are not recommended.
The system should be thermal, such as infra-red radiation or hot blast
Observe the soldering conditions as shown below.
Do not exceed these limits and avoid repeated reflowing
Reflow Soldering
T0
Pre-heat
T1
T2
T3
Temperature (°C)
20 to 140
140 to 180
180 to 140
> 200
230
Maximum Time
(Seconds)
60
150
100
60
20
Lead Free Reflow Soldering
T0
Pre-heat
T1
T2
Temperature (°C)
20 to 160
160 to 190
190 to 180
> 220
Maximum Time
(Seconds)
60
120
90
60
Size
Temperature Maximum Time
(°C)
(Seconds)
T3 Φ4 ~ Φ5 (4 – 50 V)
250
260
10
5
Φ6.3 ~ Φ10 (4 – 50 V)
250
5
Φ4 ~ Φ10 (63 – 100 V)
250
5
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
A4002_EEV • 2/21/2014 12