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BFG410W_15 Datasheet, PDF (9/12 Pages) NXP Semiconductors – NPN 22 GHz wideband transistor
Philips Semiconductors
NPN 22 GHz wideband transistor
Product specification
BFG410W
SPICE parameters for the BFG410W die
SEQUENCE No. PARAMETER VALUE UNIT
1
IS
19.42 aA
2
BF
145.0 −
3
NF
0.993 −
4
VAF
31.12 V
5
IKF
125.0 mA
6
ISE
123.6 fA
7
NE
3.000 −
8
BR
11.37 −
9
NR
0.985 −
10
VAR
1.874 V
11
IKR
50.00 mA
12
ISC
199.6 aA
13
NC
1.546 −
14
RB
35.00 Ω
15
IRB
0.000 A
16
17
18
19 (1)
20 (1)
21 (1)
RBM
RE
RC
XTB
EG
XTI
15.00 Ω
432.0 mΩ
4.324 Ω
1.500 −
1.110 eV
3.000 −
22
CJE
128.0 fF
23
VJE
900.0 mV
24
MJE
0.346 −
25
TF
4.122 ps
26
XTF
68.20 −
27
VTF
2.004 V
28
ITF
0.627 A
29
PTF
0.000 deg
30
CJC
56.68 fF
31
VJC
556.9 mV
32
33
34 (1)
35 (1)
36 (1)
37 (1)
38
MJC
XCJC
TR
CJS
VJS
MJS
FC
0.207 −
0.500 −
0.000 ns
274.8 fF
418.3 mV
0.239 −
0.550 −
SEQUENCE No. PARAMETER VALUE UNIT
39 (2)(3)
40 (2)
41 (3)
Cbp
Rsb1
Rsb2
145
fF
25
Ω
19
Ω
Notes
1. These parameters have not been extracted, the
default values are shown.
2. Bonding pad capacity Cbp in series with substrate
resistance Rsb1 between B′ and E′.
3. Bonding pad capacity Cbp in series with substrate
resistance Rsb2 between C′ and E′.
handbook, halfpage
C cb
L1
B
C be
B' C'
E'
L2
C
Cce
MGD956
L3
E
QLB = 50; QLE = 50; QLB,E(f) = QLB,E√(f/fc)
fc = scaling frequency = 1 GHz.
Fig.14 Package equivalent circuit SOT343R2.
List of components (see Fig.14)
DESIGNATION
Cbe
Ccb
Cce
L1
L2
L3 (note 1)
VALUE
80
2
80
1.1
1.1
0.25
UNIT
fF
fF
fF
nH
nH
nH
Note
1. External emitter inductance to be added separately
due to the influence of the printed-circuit board.
1998 Mar 11
9