GMM3X120-0075X2 Datasheet, PDF (2/4 Pages) IXYS Corporation – Three phase full Bridge with Trench MOSFETs in DCB isolated high current package

GMM 3x120-0075X2
Source-Drain Diode
Symbol Conditions
Characteristic Values
(T_J = 25°C, unless otherwise specified)
min. typ. max.
V_SD
(diode) I_F = 80 A; V_GS = 0 V
t_rr
Q_RM
I_F = 80 A; -di_F/dt = 800 A/µs; V_R = 30 V
I_RM
0.9 1.2 V
55
ns
0.9
µC
30
A
Component
Symbol Conditions
Maximum Ratings
I_RMS
per pin in main current paths (P+, N-, L1, L2, L3)
may be additionally limited by external connections
2 pins for output L1, L2, L3
75
A
T_J
T_stg
V_ISOL
F_C
I_ISOL < 1 mA, 50/60 Hz, f = 1 minute
mounting force with clip
-55...+175 °C
-55...+125 °C
1000 V~
50 - 250 N
Symbol Conditions
R 1)
pin to chip
C_P
coupling capacity between shorted
pins and back side metallization
Characteristic Values
min. typ. max.
tbd
mW
160
pF
Weight
25
g
1) _{VDS = ID·(RDS(on) + 2RPin to ) Chip}
IXYS reserves the right to change limits, test conditions and dimensions.
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20110307
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