CPC9909 Datasheet, PDF (12/12 Pages) IXYS Corporation – High Effciency,Off-line, High Brightness LED Driver

INTEGRATED CIRCUITS DIVISION
3.6 Packaging Information
For both the SOIC-8 and the SOIC-8 EP Packages.
CPC9909
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
B₀=5.30
(0.209)
W=12.00
(0.472)
Embossed Carrier
K₀= 2.10
(0.083)
A₀=6.50
(0.256)
P=8.00
(0.315)
User Direction of Feed
Dimensions
mm
(inches)
Embossment
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
For additional information please visit www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed
or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability
whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a
particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical
harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes
to its products at any time without notice.
Specifications: DS-CPC9909-R03
© Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/18/2012
12
www.ixysic.com
R03