CPC9909 Datasheet, PDF (11/12 Pages) IXYS Corporation – High Effciency,Off-line, High Brightness LED Driver

INTEGRATED CIRCUITS DIVISION
3.5 Mechanical Dimensions
3.5.1 8-Pin SOIC Package
Pin 8
1.270 REF
(0.050)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
4.928 ± 0.254
(0.194 ± 0.010)
1.346 ± 0.076
(0.053 ± 0.003)
0.762 ± 0.254
(0.030 ± 0.010)
0.559 ± 0.254
(0.022 ± 0.010)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
CPC9909
PCB Land Pattern
0.60
(0.024)
5.40
(0.213)
1.55
(0.061)
1.27
(0.050)
Dimensions
mm
(inches)
3.5.2 8-Pin SOIC EP Package
3.80
(0.150)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
0.762 ± 0.254
(0.030 ± 0.010)
5.40 2.75
(0.209) (0.108)
1.55
(0.061)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
1.270 REF
(0.050)
4.928 ± 0.254
(0.194 ± 0.010)
1.346 ± 0.076
(0.053 ± 0.003)
7º
1.27
(0.050)
0.60
(0.024)
Recommended PCB Land Pattern
2.540 ± 0.254
(0.100 ± 0.010)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
3.556 ± 0.254
(0.140 ±0.010)
Dimensions
mm
(inches)
Note: Thermal pad should be electrically connected to GND, pin 3.
R03
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